UPM Raflatac Introduces Thermal Top Logistics Fit PEFC Label Material

 

UPM Raflatac is introducing the new Thermal Top Logistics Fit PEFC, a self-adhesive label material designed especially for transport and logistics. It offers higher productivity through less reel changes and exceeds the environmental credentials of its predecessors, the company notes.

Thermal Top Logistics Fit PEFC resists scuffing and scratching, which makes it the perfect alternative to standard warehouse and shipping labels. Thanks to innovations in raw materials and production, it also offers excellent scanning reliability and printability with direct thermal, UV-, and water-based flexography. 

Compared with previous generations, Thermal Top Logistics Fit PEFC is significantly thinner. A thinner material allows the use of longer reels, which translates to less reel changes, less downtime, and increased efficiency. Ultimately, that also shows in lower storage and transportation costs.

Thermal Top Logistics Fit PEFC retains good paper strength for reliable conversion and offers stable matrix-stripping in mainstream logistics label production. The combination of high performance and consistent quality makes it an unbeatable choice for converters. 

Thermal Top Logistics Fit PEFC further improves the environmental performance of the label. It is made of PEFCT certified wood raw material, originating from sustainably managed forests. 

Jon Lenck, director, business segment VIP, and prime at UPM Raflatac EMEIA, shares that sustainability was a key consideration in product development. "We're proud to say that the new Honey Glassine backing HG45 PEFC is thinner than the standard HG65 without compromising performance in conversion or end use," Lenck said. "A leaner material reduces liner waste volumes and disposal costs. But it's not just waste reduction—we're talking about a lower environmental impact over the whole lifecycle in regard to water, energy, and CO2 emissions."

The Thermal Top Logistics Fit PEFC brochure can be downloaded online.