PaperCon 2019 Announces Call for Papers

The PaperCon Program Committee invites paper and packaging professionals interested in being part of PaperCon 2019 to submit an abstract by October 12, 2018. The Conference is the perfect opportunity for professionals to bring visibility to a new technology, technical success, or case study.

PaperCon 2019, scheduled for May 5-8, 2019 in Indianapolis, Indiana, is considered to be the world’s largest technical conference for the paper and packaging industry. Mill and other industry professionals gather for this premier event to learn about new technologies, advancements and processes as well as to discuss critical issues affecting the industry. The theme for the Conference is "Setting the Pace."

PaperCon 2019 will be co-located with four additional events: IPPC (International Paper Physics Conference), NETInc (Innovative Nonwovens Conference), RPTA (Recycled Paperboard), and TAPPI/IDCON Reliability & Maintenance. Attendees will be able to attend the technical programs for all events.

Abstracts are sought covering topics for the following Division tracks:

PaperCon Division Tracks

•Coating Technologies

•Papermaking: Conversions and Optimization

•Papermaking Additives

•Process Control

•Fluid Fundamentals

Co-Located Event Tracks

•Recycled Paperboard

•Mill Reliability

•Nonwovens

•Paper Physics

View the Invitation to Present for specific topics of interest within each track. The abstract submittal deadline is October 12, 2018 and should be uploaded to the TAPPI Speaker Management System.

For more information about submitting an abstract for PaperCon 2019, please visit the conference website at PaperCon.org or contact Pat Stiede at pstiede@tappi.org or Jessica Reaves at jreaves@tappi.org.

For questions about PaperCon 2019, contact Sarah Lunceford at slunceford@tappi.org or 770-209-7345.

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