Paper and Packaging Professionals Invited to Share Expertise at PaperCon 2019

PaperCon 2019, scheduled for May 5-8, 2019 in Indianapolis, Ind., USA, is considered to be the world’s largest technical conference for the paper and packaging industry. Its expert-led program addresses key challenges mill and other industry professionals face each day. Professionals and academics interested in sharing their knowledge and expertise at this premier event should submit an abstract by the October 12, 2018 deadline.

PaperCon draws over 1,900 mill and other industry professionals from around the world who are eager to learn about new innovations, advancements and processes as well as to discuss critical issues affecting the industry. As a speaker in the technical program, individuals have the perfect opportunity to bring visibility to a new technology, technical success, or case study.

PaperCon 2019 will be co-located with four additional events: IPPC (International Paper Physics Conference), NETInc (Innovative Nonwovens Conference), RPTA (Recycled Paperboard), and TAPPI/IDCON Reliability & Maintenance. Attendees will be able to attend the technical programs for all events.

Abstracts are sought covering topics for the following Division tracks:

PaperCon Division Tracks:

•Coating Technologies

•Papermaking: Conversions and Optimization

•Papermaking Additives

•Process Control

•Fluid Fundamentals

Co-Located Event Tracks:

•Recycled Paperboard

•Mill Reliability

•Nonwovens

•Paper Physics

View the Invitation to Present for specific topics of interest within each track. The abstract submittal deadline is October 12, 2018 and should be uploaded to the TAPPI Speaker Management System.

 

For more information about submitting an abstract for PaperCon 2019, please visit the conference website at PaperCon.org or contact Pat Stiede or Jessica Reaves.

 

For questions about PaperCon 2019, contact Sarah Lunceford by email or call 770-209-7345.