Students: Applications for TAPPI Scholarships are Due February 25
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Each year, TAPPI proudly offers multiple scholarship opportunities to graduate and undergraduate students in the pulp, paper, packaging and related industries. There are several Technical Division scholarships totaling more than $50,000 available for the 2022-2023 academic year. The application submission date has been extended to February 25, 2022.
Students pursuing careers in the packaging industry are encouraged to apply for the International Flexible Packaging and Extrusion Division’s Daniel Siegel Memorial Scholarship, a $4,000 scholarship presented in even-numbered years to a TAPPI Student Chapter member enrolled in a packaging or related major. The scholarship is funded by an endowment from the MICA Corporation and the Siegel family.
In addition to Technical Division scholarships, TAPPI offers the William L. Cullison Memorial Scholarship, a $4,000 scholarship for a junior or senior pursuing an academic path related to a career in the pulp, paper, corrugated and converting industries.
You are encouraged to apply for all of the scholarships for which you qualify.
Now’s a great time to start lining up those letters or recommendation, too. Scholarship application requirements vary and require letters of recommendation. Don’t wait until the last minute to ask your co-op and internship supervisors, professors and advisors for their support.
To access scholarship applications and Division specific guidelines visit the TAPPI scholarship information page or contact the Awards Department at awards@tappi.org.
