NEW TAPPI Webinar: Four Ways Packaging Manufacturers Use IIoT to Solve Their Biggest Challenges
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In an industry with thousands of variables in a single process, packaging manufacturers need to find ways to reduce costs to improve their bottom line and meet challenging demands. Spending hours finding new optimizations, fixing an unexpected break, or guessing ways to improve tensile strength to meet quality expectations is not an ideal path to come out on top.
Over the course of this webinar, Maddi Rudman and Paul Trelc of Braincube will delve into how data-driven decision making enabled by the Industrial Internet of Things (IIoT) platform with Braincube Digital Twin and business intelligence apps can help the world's top packaging manufacturers address common challenges to stay competitive and find continued success in this aggressive, ever-evolving market. Participants can expect to learn how to:
- Apply IIoT to improve packaging manufacturing processes, product quality, and asset maintenance
- Develop a digital transformation plan and make the case for Industry 4.0
Register today for the Four Ways Packaging Manufacturers Use IIoT to Solve Their Biggest Challenges webinar held Tuesday, March 22nd from 11:00am - 11:45am (EDT).
Meet Presenters:
Maddi Rudman is an experienced recruiter and sales professional, helping a variety of professional organizations hire the top tech talent in the country. In her role at Braincube, she guides leading manufacturing companies in their path to industrial transformation and develops custom solutions to meet their business objectives. Maddi specializes in paper and packaging manufacturing, as well as CPG, and chemical manufacturing. She has a BA in Anthropology from Trinity College.
Paul Trelc is an experienced Operations Manager and IIoT Consultant with a demonstrated history of working in the information technology and services industry. After 18 years in paper manufacturing, Paul joined Braincube and has been consulting for the past 10 years on IIoT implementation and continuous improvement for leading paper manufacturers. He has a BS in Mechanical Engineering and an MS in Pulp & Paper Science from the Institute of Paper Science & Technology at Georgia Tech.
Register today for the Four Ways Packaging Manufacturers Use IIoT to Solve Their Biggest Challenges webinar held Tuesday, March 22nd from 11:00am - 11:45am (EDT).
Webinar attendance is free and open to everyone, but registration is required.
Reserve your space today!
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