The Industry Talent Pipeline Starts at Student Summit
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Establish Your Company and Brand Among the Industry Talent of Tomorrow
The 2023 TAPPI-PIMA Student Summit, January 13-16 in Cincinnati, Ohio, offers you the rare opportunity get to know students, be part of the fun, and develop relationships that will help solidify your talent pipeline. Regardless of your current hiring needs, sponsorship – and your presence at this event – will solidify your company and brand as an industry leader among the talent of tomorrow.
As a sponsor, you’ll get to know 200+ students from multiple engineering programs, all interested in a deeper understanding of our industry, and their future within it. Your participation will help the students understand the value of staying in our industry after graduation. As a sponsor, you can choose your level of involvement, from helping to develop weekend programming, including moderating roundtables to simply cheering students on during their team challenges.
If you choose to also be an interviewing sponsor, you’ll have access to student resumes in advance, allowing you to tap potential candidates for onsite interviews.
What is the TAPPI-PIMA Student Summit? It's the industry’s only event that brings together students from paper and packaging schools and reinforces their interest in seeking a career in the pulp, paper, packaging, tissue, and converting industries. The Student Summit offers students direct interaction with their peers, industry leaders, and companies such as yours that are seeking qualified employees, interns, or co-ops.
Why interview at the TAPPI-PIMA Student Summit? You’ll save on recruiting expenses while maximizing your exposure to a highly qualified, industry-specific talent pool. Let the Student Summit help establish your company as an industry leader to these future professionals and you’ll stand out from the crowd of other potential employers.
See how the TAPPI-PIMA Student Summit can get your company noticed. Go to tappistudentsummit.org for more information or contact Shane Holt at +352-333-3345 or sholt@naylor.com.
Previous Student Attendees From: Auburn University, Clemson University, Georgia Tech, Grenoble INP – Pagora (France), Miami University, Michigan State University, North Carolina State University, Oregon State University, State University of New York, University of Maine, University of Minnesota, University of Washington, University of Wisconsin – Stevens Point, University of Wisconsin - Stout, Western Michigan University
Previous Sponsors Include: Andritz, BHS Corrugated, BTG Americas, Buckman, Domtar, Ecolab/Nalco Water, Georgia-Pacific, Graphic Packaging, Greenpac Mill, Greif, International Paper, Jacobs, Kemira, Packaging Corporation of America, RPTA, Sappi, Solenis, Twin Rivers, UPM, Valmet, WestRock, and Wood.
