TAPPI Over The Wire Paper 360
Past Issues | Printer Friendly | TAPPI.org | Advertise | Buyers Guide | Travels with Larry Archive Facebook Twitter LinkedIn
       

Application Deadline Extended to June 16 for CorrExpo What’s New?/Tech Talks

Print Print this Article | Send to Colleague

CorrExpo exhibitors, the What’s New?/Tech Talks sessions are an opportunity to showcase your latest developments at this premiere industry event, August 28-30 at the Huntington Convention Center in Cleveland, Ohio.

Back by popular demand, What’s New?/Tech Talks is part of the programming held on the main stage of the exhibit floor. During the sessions, participating CorrExpo exhibitors present seven-minute presentations highlighting their new technology, product or service without commercialism guidelines/restrictions, while still adhering to TAPPI anti-trust guidelines. “New” is defined as having been introduced to the market after January 2022.

Submitting a 2023 What’s New?/Tech Talks application is easy. Current exhibitors must provide title, speaker’s name and contact information, company name, and a short abstract to TAPPI’s Speaker Management System by Friday, June 16, 2023. Abstracts should be 50 words or less and describe what the presentation is about. Visit correxpo.org/tech for more information on the process, procedure, and requirements.

Following the submission deadline, the CorrExpo Technical Program Committee will review submitted abstracts and acceptances will be sent Friday, June 23, 2023.

CorrExpo 2023 provides industry decision makers with a variety of unique connections through networking events, educational opportunities and an extensive show floor.

For more information on What’s New?/Tech Talks or CorrExpo programming, visit correxpo.org or contact TAPPI Converting Division Manager Lisa Rushin or call directly at 770-209-7313. For information on exhibits and sponsorship opportunities, contact Linda Cohen or call 914-944-0135.

 

Back to TAPPI: Over The Wire

Share Share on Facebook Share on Twitter Share on LinkedIn