With a sharp, in-depth focus on the paper machine, TAPPI's PaperCon 2010 program explores wet end innovations from a unique perspective, bringing the world's top machinery and clothing manufacturers together in a first-ever collaborative effort to set the best technology paths forward in a post-recession global paper industry. Four key sessions examine the latest thinking and approaches in the headbox/forming and press section areas of the paper machine wet end.
A shoe press panel discussion on Tuesday, May 4, combines the collective insights of panelist experts from Voith Paper, Paperchine, and Metso. This is followed by a Press Section Innovations technical session that features presentations by teams from Xeirum Technologies, AstenJohnson, and Wells Enterprises. A session on Headbox and Forming Innovations for Packaging Grades on Wednesday, May 5, features papers by Voith Paper, Metso, GL&V, and Paperchine. The Paper Grades counterpart to this session occurs later that day, bringing together the expertise and viewpoints of speakers from Paperchine, Metso, International Paper, and the University of Maine. This carefully balanced, cooperative lineup provides a full-view perspective of where the world paper industry currently is technologically and its best-bet routes to survival entering the second decade of this new century.
PaperCon 2010 will take place May 2 - 5 at the Hyatt Regency Atlanta, Atlanta, Ga., USA. More information about the program, events, and the trade fair are available online. Contact information about sponsorship/exhibit opportunities is also available on the event website, as well as the Twenty-Third Process Industry Reliability & Maintenance Conference being co-located with PaperCon 2010.
TAPPI
http://www.tappi.org/