"The key capability that we're gaining with the Cincinnati package design center is increased speed to market for our customers in the Tri-State area," said Chris Baum, xpedx's GM, Indiana, Kentucky, and Ohio Divisions. "Since xpedx is material neutral, we're able to manage the entire process from concept and design to assembly and delivery. As a sole source packaging supplier, we give our customers a simpler, faster path to bring their products to market."
xpedx's Cincinnati package design center will serve food service and retail packaging customers in Ohio, Kentucky, and Indiana. However, xpedx also has package design centers with additional areas of specialty nearby in Livonia, Mich., and Pittsburgh, Pa. The Cincinnati package design center can easily access automotive and manufacturing package design expertise from those centers, as well. Throughout North America, xpedx has a network of 10 package design centers and teams of design experts in 12 additional markets.
The new design center features xpedx's GlobalPKG software, which is web-based packaging development and management technology that allows for specification management to take place at any of xpedx's interconnected design centers in North America. The Cincinnati location also has ArtiosCAD, Kongsberg CAD, and a Gaynes Drop Tester.
"With these systems all in-house in Cincinnati, xpedx can quickly design, test and produce packaging that reduces costs and drives profitability," said Baum. "Customers can have all that work done in one place by the xpedx team, without having to coordinate multiple packaging vendors. Their products go to market faster with less cost."
xpedx creates material-neutral package designs using corrugated, folding carton, specialty foams, thermoformed plastics, molded fiber, and pulp and flexible packaging.
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