PaperCon 2013 Will Have Expanded Technical Programs, More Opportunities for Networking

After a record attendance in 2012, PaperCon will bring together a wider assortment of CEOs, mill managers, superintendents, scientists, process engineers, and suppliers for the 2013 conference, scheduled for April 27 to May 1, in Atlanta, Ga., USA. PaperCon 2013 has expanded its already comprehensive technical program to include two new events covering tissue and nonwovens technology.

"PaperCon 2013 attendees will benefit from an expanded program providing additional learning and networking opportunities in several key areas," comments Larry N. Montague, TAPPI president and CEO. "Two co-located events - Tissue360º Forum and NETInc – will make new tissue and nonwovens tracks available to full conference registrants. Expanded coverage of these dynamic industry segments makes PaperCon an even more valuable resource."

PaperCon's large and comprehensive technical program, the industry's largest, offers a range of topics including Management (PIMA) Papermaking, Coating and Graphic Arts, Recycled Paperboard (RPTA Production - Technical Seminar), and Reliability (OpEx Workshop). An array of networking opportunities such as the PaperCon trade fair, receptions, lunches, and committee meetings, and a New Technology Showcase will make it the industry's must-attend event in 2013.

More information is available online.

TAPPI
http://www.tappi.org/