Window for PaperCon Abstracts Closing Soon
PaperCon 2019 Abstract Deadline Extended to October 26.
Not everyone has the opportunity to share their experience and expertise with their peers and help set the pace for the future, but you do. The PaperCon planning committee invites you to speak at the 2019 conference and discuss your latest technical success, new technology, or case study with key industry decision-makers. But, you must hurry! The deadline to submit your abstract for consideration in the PaperCon 2019 technical program is October, 26, 2018.
TAPPI's PaperCon 2019, scheduled for May 5-8, 2019 in Indianapolis, Indiana, is considered to be the world’s largest technical conference for the paper and packaging industry. Mill and other industry professionals gather for this premier event to learn about new technologies, advancements, and processes as well as to discuss critical issues affecting the industry. The theme for the Conference is "Setting the Pace."
PaperCon 2019 will be co-located with four additional events: IPPC (International Paper Physics Conference), NETInc (Innovative Nonwovens Conference), RPTA (Recycled Paperboard), and TAPPI/IDCON Reliability & Maintenance. Attendees will be able to attend the technical programs for all events.
Abstracts are sought covering topics for the following Division tracks:
PaperCon Division Tracks
• Coating Technologies
• Papermaking: Conversions and Optimization
• Papermaking Additives
• Process Control
• Fluid Fundamentals
Co-Located Event Tracks
• Recycled Paperboard
• Mill Reliability
• Nonwovens
• Paper Physics
If you are interested in submitting an abstract but need some additional time or have questions about PaperCon 2019, please
contact Sarah Lunceford, PaperCon account manager (slunceford@tappi.org) or 770-209-7345.
For more information about submitting an abstract for PaperCon 2019, please visit the conference website at PaperCon.org or
contact Pat Stiede (pstiede@tappi.org) or
contact Jessica Reaves at jreaves@tappi.org.
TAPPI
http://www.tappi.org/