Wet-lay technology has been used in the nonwoven industry for several decades, enabling the manufacture of strong products at high production rates.
Unfortunately, wet-lay technology also has many disadvantages such as low fiber consistency during forming, limited quality range and length of fibers that can be utilized due to strong flocculation tendencies, and high density of the final product. NETInc 2019 attendees will learn about a new process advancement developed to solve many of these wet-lay challenges.
During NETInc 2019 (Innovative Nonwovens Conference), May 5-8, 2019 in Indianapolis, Indiana, Kristian Salminen, Technology Manager at VTT Technical Research Centre of Finland Ltd, will discuss how foam forming technology can help solve many wet-lay problems by enabling improved structural uniformity, increased fiber consistency during forming, an expanded range of raw materials used in the products, and density control of the final product. He will also demonstrate how controlling the main characteristics of foam (air content, bubble size distribution, foam stability and foam chemistry) can create new opportunities to customize the structure and performance of the manufactured products.
NETInc 2019 is the only nonwovens technical conference developed by engineers and technologists to help individuals understand the science and how it impacts the market. It is a forum for industry experts and professionals to share and discuss the latest innovations, best practices and key issues affecting the industry. Attendees will discover new products, sustainability technologies, and process advancements. They will also learn about new nano- and micro-technologies and functional finishes.
Attendees will also have the opportunity to network with their nonwovens peers at one or more special events scheduled throughout the conference, as well as discover new products and services presented by leading companies in the exhibit hall.
Organized by TAPPI’s Nonwovens Engineers and Technologists (NET) Division, NETIncis co-located with TAPPI’s PaperCon 2019Conference as well as the International Paper Physics Conference (IPPC), RPTA Production-Technical Seminar, and TAPPI/IDCON Reliability & Maintenance. Attendees will be able to attend sessions from all events for only one registration fee.
Register for NETInc by April 5thand save up to $400. Mills have the opportunity to take advantage of special mill discounts! Attendees can also receive a special hotel conference rate if they book their room by April 15th.
Get more details about the technical program, special events and hotel discounts at NETIncEvent.org.
TAPPI
http://www.tappi.org/