Become a 2023 Student Summit Sponsor and Meet the Best and Brightest Candidates
The 2023 TAPPI-PIMA Student Summit, January 13-16 in Cincinnati, Ohio, offers you the rare opportunity to not only conduct traditional interviews with multiple recruits during the weekend event, but to get to know the students, be part of the fun, and develop relationships – something that isn’t possible through the average Career Day.
By becoming a sponsor, you’ll have a chance to get to know 200+ students from multiple engineering programs, all interested in starting their careers out right. As an interviewing sponsor, you’ll have access to student resumes in advance, allowing you to tap potential candidates for onsite interviews. All sponsors are encouraged to participate in the weekend programming, including moderating roundtables or cheering students on during their team challenges.
What is the TAPPI-PIMA Student Summit? It's the industry’s only event that brings together students from paper and packaging schools and reinforces their interest in seeking a career in the pulp, paper, packaging, tissue, and converting industries. The Student Summit offers students direct interaction with their peers, industry leaders, and companies such as yours that are seeking qualified employees, interns, or co-ops.
Why interview at the TAPPI-PIMA Student Summit? You’ll save on recruiting expenses while maximizing your exposure to a highly qualified, industry-specific talent pool. Let the Student Summit help establish your company as an industry leader to these future professionals and you’ll stand out from the crowd of other potential employers.
See how the TAPPI-PIMA Student Summit can get your company noticed. Go to tappistudentsummit.org for more information or contact Shane Holt at +352-333-3345 or sholt@naylor.com.
Previous Student Attendees From: Auburn University, Clemson University, Georgia Tech, Grenoble INP – Pagora (France), Miami University, Michigan State University, North Carolina State University, Oregon State University, State University of New York, University of Maine, University of Minnesota, University of Washington, University of Wisconsin – Stevens Point, University of Wisconsin - Stout, Western Michigan University
Previous Sponsors Include: Andritz, BHS Corrugated, BTG Americas, Buckman, Domtar, Ecolab/Nalco Water, Georgia-Pacific, Graphic Packaging, Greenpac Mill, Greif, International Paper, Jacobs, Kemira, Packaging Corporation of America, RPTA, Sappi, Solenis, Twin Rivers, UPM, Valmet, WestRock, and Wood.
TAPPI
http://www.tappi.org/