The Technical program for TAPPI’s 2024 FlexPack PLACE, happening April 14-17, 2024 in San Diego, CA, is chock full of the flexible packaging industry’s hottest topics.
Over the course of four days, you’ll have opportunities to learn about oriented films, extrusion coating, high barrier sustainable package designs, incorporating recycling protocols into the design phase, as well as two sessions dedicated to additives. Sustainability priorities also take center stage. View the program and start planning how best to spend your time in San Diego.
FlexPack PLACE’s technical program is peer-reviewed and peer-designed to specifically meet the needs of flexible packaging professionals like you. Don’t miss this opportunity to learn from leading subject matter experts.
Students interested in pursuing careers in the flexible packaging industry are also encouraged to attend FlexPack PLACE. Applications for the International Flexible Packaging Division’s scholarship as well as the $7,000 Daniel Siegel Memorial Scholarship are now available online and are due February 15. The scholarships will be presented at this year’s conference.
FlexPack PLACE is a biennial event bringing together the entire supply chain serving all key industry sectors, including food and beverage, consumer packaged goods, cosmetics, pharma, retail, industrial and more. Register today!
For more information, please visit the FlexPack PLACE website.
TAPPI
http://www.tappi.org/