August 2012
Over The Wire Tissue Edition
Archive/Subscribe | TAPPI.org | Advertise | TAPPI Press Catalog
 

Kemira KemFlite Eiminates Paper Machine Deposition

Print Print this article | Send to Colleague

​Kemira, Finland, has introduced KemFlite™, a new concept to reduce paper and board machine problems caused by deposits due to the agglomeration of hydrophobic particles. These particles typically originate from wood pitch, stickies, or binders in coated broke and have previously been difficult to detect and control.

Under certain conditions, the particles agglomerate to a larger size and eventually deposit on paper machine wet-end surfaces, wires, felts, and dryer cans. KemFlite is designed to manage the hydrophobic substances, particularly their size, before they form deposits. These tools include Kemira Flyto™, a laboratory analysis to measure the particle size, quantity, and hydrophobicity in samples taken from key points in the process, and Kemira AutoFlite™, a new on-line device that continuously provides similar information.

Following a complete mill survey by Kemira’s application experts, a tailor-made deposit control program can be implemented to manage the hydrophobic substances found in a mill’s process waters and eliminate machine deposition. The KemFlite concept has been proven in numerous mill cases where it has improved machine runnability and reduced defects such as holes, spots, specks, and hickeys in the final paper or board product.

The result for papermakers is smoother operation, decreased downtime, better cost efficiency, reduced chemical consumption, and improved finished paper and board quality.

More information is available online.

 

 

Share Share on Facebook Share on Twitter Share on LinkedIn

Buckman

TAPPI Over the Wire - Tissue Edition | 15 Technology Pkwy. S. | Norcross, GA 30092 USA | Voice: 770.446.1400 | Fax: 770.446.6947